Moore’s Law Lives On: Intel Paves Way To A Trillion Transistors In Next-Gen Chips By 2030 - Wccftech

At IEDM, Intel Research has showcased how Moore's Law is Alive & how Chipzilla plans to offer next-gen chips with a Trillion transistors by 2030.

Press Release: At IEDM 2022, on the 75th anniversary of the transistor, Intel targets new 10x density improvement in packaging technology and uses novel material just 3 atoms thick to advance transistor scaling.

At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore’s Law alive and well for years to come.”.

At IEDM 2022, Intel’s Components Research Group showed its commitment to innovating across three key areas to continue Moore’s Law: new 3D hybrid bonding packaging technology to enable seamless integration of chiplets; super-thin, 2D materials to fit more transistors onto a single chip; and new possibilities in energy efficiency and memory for higher-performing computing.